Semiconductors
Top stories summarized by our editors
7/13/2018

The leaders of Mentor Graphics and Siemens PLM Software spoke about the industrial internet of things market during the recent Design Automation Conference in San Francisco. Tony Hemmelgarn of Siemens PLM touted the digital twin concept, which creates a digital version of machinery and other products.

7/13/2018

Siemens will work with Alibaba Cloud to support industrial internet of things technology efforts in China under a memorandum of understanding signed in Berlin. At the same ceremony, Nokia and China Mobile signed a one-year agreement valued at up to $1.17 billion to develop a next-generation network in China.

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EE Times
7/13/2018

High-tech companies are taking sides on approaches to linking multiple chips, Mark LaPedus writes. Intel touts its Embedded Multi-die Interconnect Bridge technology, while other companies are implementing interposers with through-silicon vias as the path to interconnection.

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Intel, Mark LaPedus
7/13/2018

Researchers at Switzerland's Paul Scherrer Institute used soft X-rays to closely observe the mobility of electrons in a gallium nitride transistor. High-electron-mobility transistors will be key to implementing 5G cellular communications on a commercial basis, according to the team.

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New Electronics
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Paul Scherrer Institute
7/13/2018

Artificial intelligence technology will play a greater role in the development of advanced microchips as Moore's Law runs out of steam, technologists say. "The time of the node train is coming to an end," says Steve Ghanayem of Applied Materials.

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EE Times
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Moore, Applied Materials
7/12/2018

Leti and Soitec said they signed a five-year partnership agreement to work together on advanced engineered substrates, such as silicon-on-insulator and other technologies. Their Substrate Innovation Center will include a focused pilot line.

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New Electronics
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Leti, Soitec
7/12/2018

GlobalFoundries has realized more than $2 billion in revenue from its 22-nanometer fully depleted silicon-on-insulator process technology, known as 22FDX, involving over 50 client designs. The foundry asserts the 22FDX process is used for power-optimized applications, such as 5G connectivity, automotive chips and the internet of things.

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DigiTimes
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GlobalFoundries
7/12/2018

Macronix International brought out the MX25S line of serial peripheral interface NOR flash memories for 5G internet of things devices. The memory chips run on 1.2 volts and consume just 0.007 microamperes in the deep power down state, it was said.

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DigiTimes
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Macronix International
7/12/2018

The semiconductor industry is seeing a global rush to develop artificial intelligence and deep learning chips that will operate at the edge of the network, this analysis notes. "It seems like every week, I run into a new company in this space, sometimes someone in China that I've never heard of," says David Kanter of Real World Technologies.

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EE Times
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rush, David Kanter
7/12/2018

Testing autonomous vehicle technology is proving to be more difficult than expected. Derek Floyd of Advantest says, "For any new design, you need to test the silicon, validate it, ship it to the customer, and then it undergoes 12 to 18 months of field trials before they actually accept the product."

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Advantest