Semiconductors
Top stories summarized by our editors
1/18/2018

The AS7265X 18-channel multispectral sensor chipset was brought out by ams, meant for multiple spectral sensing applications. The chipset could be used in anti-counterfeiting and authentication measures, fluid quality/spectral component analysis and horticulture.

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New Electronics
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AMS
1/18/2018

Dialog Semiconductor has introduced the GreenPAK SLG46824 and SLG46826 configurable mixed-signal ICs with in-system programming. The chips are the first CMICs debuted by Dialog since its recent acquisition of Silego Technology, a CMIC developer.

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DigiTimes
1/18/2018

Executives in the high-tech industry provide predictions on what will happen this year for companies, devices and semiconductor manufacturing. "2018 will be the takeoff of 28 and 22nm FD-SOI SoC projects," says Graham Bell of Uniquify.

1/17/2018

Rep. Jerry McNerney, D-Calif., sent a letter to the CEOs of Intel, Advanced Micro Devices and Arm Holdings, requesting a briefing on the cybersecurity risks posed by the Meltdown and Spectre vulnerabilities in microchips. "I am looking to better understand the nature of these critical vulnerabilities, the danger they pose to consumers, and what steps your companies plan to take to protect consumers," he wrote in the letter.

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Reuters
1/17/2018

Nanya Technology President Lee Pei-ing asserts that DRAM manufacturers in China should license crucial memory technologies, or their chips developed in-house won't be competitive in the world market. Allegations of stolen intellectual property and trade secrets, along with patent-infringement lawsuits, against Chinese companies will foster a negative image of DRAMs made in China, he says.

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DigiTimes
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Nanya
1/17/2018

In 2017, IBM received more than 1,900 patents related to cloud technology, along with 1,400 artificial intelligence patents, 1,200 cybersecurity patents, and more patents related to blockchain and machine-learning technology. The company also debuted the Power9 processor, which is expected to see use in the IBM Cloud, the Google Cloud and other cloud-based computing services.

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Forbes
1/17/2018

Several companies are working on wireless charging options, including Ossia Inc., which unveiled its wireless charging transmitter at CES last week and reports it's capable of charging devices from up to 30 feet away. Another company, Energous Corp., recently received Federal Communications Commission certification on a similar device, WattUp, which is capable of charging from 3 feet away.

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FCC
1/17/2018

Infineon Technologies has introduced the IR38163/5 and IR38363/5 integrated point-of-load regulator chips, supporting PMBus and other functionalities. The IPOL devices could be used in telecommunications, network communications and data-storage applications, along with servers based on Intel chipsets.

1/17/2018

Data buffering technology could become crucial in the operation of autonomous vehicles and data centers, along with machine-learning applications, this analysis notes. It could also prove useful in heterogeneous computing systems.

1/16/2018

United Microelectronics escalated a legal dispute with Micron Technology, filing a patent infringement lawsuit against two Micron subsidiaries in the Fuzhou Intermediate People's Court. The complaint in the Chinese court seeks nearly $42 million in damages over memory chip technology used in graphics cards and solid-state drives; Micron last year alleged that two former employees of Micron Taiwan stole DRAM fabrication trade secrets before they joined UMC.

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DigiTimes