Semiconductors
Top stories summarized by our editors
5/25/2018

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smartbrief.com
5/25/2018

China will construct new semiconductor fabrication plants as part of President Xi Jinping's "Made in China 2025" plan, which includes a goal of turning China into a technological leader. "As China embarks on the 'Made in China 2025' plan with electronics and semiconductor technology as one of the Top 10 focus areas, [its] semiconductor industry has an unprecedented growth opportunity," SEMI China President Lung Chu said.

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Asia Times
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China, President Xi Jinping
5/25/2018

Samsung has discussed its upcoming process technology plans, including updates on 7-nanometer Low Power Plus, 5nm Low Power Early, 4nm Low Power Early/Plus and 3nm Gate-All-Around Early/Plus technologies.

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DigiTimes
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Samsung
5/25/2018

Clariant's Humitector Type 2 nonreversible humidity indicator cards are now available, providing protection for moisture-sensitive devices. The cards have been approved by JEDEC to be used in surface mount devices' dry packing.

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Clariant, JEDEC
5/25/2018

Researchers claim that they can generate microwaves using silicon, which carries about one-twentieth the cost of gallium arsenide and could allow for reduced costs in sensors and other devices. Chalmers University of Technology's Daryoush Shiri used computational nanotechnology to demonstrate that silicon nanowires can emit microwaves when exposed to increased voltage.

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New Electronics
5/25/2018

The move to Verification 3.0 will provide new challenges and opportunities in the electronic design automation space, writes Brian Bailey. While traditional EDA firms will plan an important role, "startups have much more innovative ideas and the ability to turn on a dime in response to market needs and business models," he writes.

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Brian Bailey
5/24/2018

The future of the semiconductor industry lies in "heterogeneous integration of different technologies," not pitch shrinkage, said Etron Technology founder and CEO Nicky Lu. "The mystery of scaling solved by the chip industry can now apply to creating nano-modules for artificial intelligence, IoT, and living things," he said.

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EE Times
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Nicky Lu, Etron Technology
5/24/2018

Artificial intelligence, new communications protocols and the cloud are providing opportunities and challenges within the chip industry, said a group of industry CEOs. Arm CEO Simon Segars outlines a few challenges, such as, "The cost of building a 7nm chip is not for the faint of heart. Managing complexity gets worse at every node."

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Simon Segars
5/24/2018

China has added Loongson, Shenwei and Phytium to its government procurement list for 2018 and 2019. The move represents the first time that China's procurement plan has included servers powered by domestically manufactured central processing units.

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China
5/24/2018

Penn State University researchers have discovered that a piezoelectric ceramic foam can be supported by a flexible polymer to improve mechanical and thermal energy harvesting. "We were able to show theoretically that the piezoelectric performance of nanoparticle/nanowire composites is critically limited by the large disparity in stiffness of the polymer matrix and piezoceramics, but the 3D composite foam is not limited by stiffness," Penn State professor Sulin Zhang said.

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New Electronics
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Penn State University